福英达
福英达

Shenzhen Fitech Co., Ltd.

Fitech’s Ultra-Fine Solder Assists in Innovation


Fitech is a National High-Tech Enterprise and world-leading solution provider of microelectronics and semiconductor packaging materials. It has been deeply involved in the microelectronics and semiconductor packaging material industry since 1997.


Fitech has a complete product line from solder powder to application products and is the only manufacturer of electronic-grade packaging materials that can produce T2-T10 full-size ultra-fine solder powder.


Shenzhen Fitech Co., Ltd.
Fitech's products such as solder paste, epoxy solder paste and solder powder are widely used in various fields of microelectronics and semiconductor packaging. The products are generally recognized by global SMT electronic chemical manufacturers, micro photoelectric manufacturers, and semiconductor packaging testers.

Shenzhen Fitech Co., Ltd.

Fitech’s Ultra-Fine Solder Assists in Innovation
Shenzhen Fitech Co., Ltd.

Fitech is a National High-Tech Enterprise and world-leading solution provider of microelectronics and semiconductor packaging materials. It has been deeply involved in the microelectronics and semiconductor packaging material industry since 1997.


Fitech has a complete product line from solder powder to application products and is the only manufacturer of electronic-grade packaging materials that can produce T2-T10 full-size ultra-fine solder powder.


Fitech's products such as solder paste, epoxy solder paste and solder powder are widely used in various fields of microelectronics and semiconductor packaging. The products are generally recognized by global SMT electronic chemical manufacturers, micro photoelectric manufacturers, and semiconductor packaging testers.
2021
2021
Certificates of ISO14001-2015, ISO9001-2015 and QC080000-2017.
2020
2020
Launch of water-soluble solder paste and gold-tin solder powder/solder paste.
2019
2019
Introduced solder paste products for mini/microLED
2017
2017
Certificates of the National High-Tech Enterprise and Shenzhen High-Tech Enterprise.
2016
2016
Low-temperature high-strength solder FL170/180/FL200 were developed.
2015
2015
The company was relocated to the Bao’an Industrial district, improving its research and development abilities.
2014
2014
Scale production of T6-T7 ultra-fine solder powder.
2010
2010
A production rate of 1500t/year for centrifugal atomization solder power.
2006
2006
A production rate of 220t/year for ultrasonic atomization solder powder.
1997
1997
The establishment of Fitech in Shekou.

发展历程

development path

2021
Certificates of ISO14001-2015, ISO9001-2015 and QC080000-2017.
2021
2020
Launch of water-soluble solder paste and gold-tin solder powder/solder paste.
2020
2019
Introduced solder paste products for mini/microLED
2019
2017
Certificates of the National High-Tech Enterprise and Shenzhen High-Tech Enterprise.
2017
2016
Low-temperature high-strength solder FL170/180/FL200 were developed.
2016
2015
The company was relocated to the Bao’an Industrial district, improving its research and development abilities.
2015
2014
Scale production of T6-T7 ultra-fine solder powder.
2014
2010
A production rate of 1500t/year for centrifugal atomization solder power.
2010
2006
A production rate of 220t/year for ultrasonic atomization solder powder.
2006
1997
The establishment of Fitech in Shekou.
1997
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Fitech Provides Services for Customers Globally

With Semiconductor Packaging Solder Solutions
Fitech Provides Services for Customers Globally
Market Area
China
USA
India
Germany
Japan
South Korea