The Fitech Anisotropic Conductive Adhesive (FACA) is made of low-temperature ultra-fine SnBiAg solder powder with excellent sphericity, uniform particle size, and low oxygen content and active flux. The conductive filler has uniform particle size and outstanding product dispersibility. Bonding of insulated material after hot-pressing curing increases soldering strength and reliability. No solvent volatilization occurs during hot-pressing curing. The temperature of hot pressing is low. The solder powder melts and metallurgically connects with the pad. In addition, anisotropic conductive paste has the properties of longitudinal conductive and non-conductive in the transverse direction. It is used for soldering between two fine-pitch conductive connection points in the manufacture of electronic components to avoid short circuits and improve yield. In addition, FACA is widely used in touch screens, smart card, radio frequency identification (RFID), flip chips, FPC, and other products. It is suitable for the assembly and packaging of ultra-fine pitch microelectronic circuits and has contributed to the miniaturization of microelectronic packaging.