Low-alpha high-lead solder series is developed by Fitech based on customer requirements. Tiny amounts of alpha particles emitted by packaging materials can cause soft errors and adversely impact miniaturized high-reliability devices. As a result, packaging materials must have a low alpha particle count. Fitech's T3 to T6 low-alpha products include Sn5Pb92.5Ag2.5, Sn5Pb95, and other alloys. Fitech’s low-alpha high-lead solder products have the advantages of outstanding solder powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity. The alpha particle emission strictly follows the specifications. Fitech is willing to provide customized development services if it is necessary.