福英达
福英达

INTEGRATED CIRCUIT PACKAGING

Integrated circuit packaging provides mechanical and electrical connections for IC chips. It also supplies physical protection. As a result, the integrated circuit chips have a stable and reliable operating condition. With the packaging development, manufacturers have adopted various advanced packaging technologies such as system-in-package (SiP) and system-on-chip (SoC), followed by a series of new challenges for packaging materials such as chip miniaturization, yield improvement, and cost reduction. Fitech provides reliable solder and solution support for integrated circuit packaging in various fields.



SiP Solution

Related Products

FL-170/180/200
FT-574

Description
FL170 is a low-temperature alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength. It is combined with zero-halogen flux to produce FL-170 series low-temperature solder paste. Only a tiny amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. The solder paste has outstanding residue minimization and wettability. The solder joints generated are solid, plump, and bright. FL-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 


Fatigue Impact Test


F
eatures and Advantages

1. Excellent soldering strength with a peak reflow temperature of 170℃;

2. Antimony-free, lead-free and environmental-friendly;

3. Outstanding thixotropy and appropriate viscosity available for jet printing, pin transfer, dispensing, printing, etc.;

4. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

5. Extraordinary soldering performance and proper wettability in different parts;

6. Less residue production after drying, no solder ball formation, and reliable solder joints.


Description
Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with zero-halogen flux to prepare FT-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation. Only a tiny amount of residue generates after soldering. Moreover, FT-574 has excellent wettability. The solder joints formed are plump and bright. The product is suitable for low-temperature component mounting.


Features and Advantages

1. Excellent wettability, solder ball elimination, and wettability;

2. Outstanding thixotropy and appropriate viscosity for the processes of jet printing, pin transfer, dispensing, printing, etc.;

3. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

4. Extraordinary soldering performance and proper wettability in different parts;

5. Environmental-friendly product using zero-halogen formula.


Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product