福英达
福英达

POWER DEVICE PACKAGING

Power semiconductor devices, also known as power electronic devices, are mainly used for power conversion and control of power equipment. Power electronics is a supporting technology for modern science, industry, and national defense, and power devices are the core and foundation of power electronics technology. For instance, if the human body is used as an analogy, power electronic devices are equivalent to the cardiovascular and limbs of the human body that is responsible for supporting human activities. Power devices such as a thyristor, GTO, GTR, Power MOSFET, IGBT, IGCT, and others are widely applied in advanced energy, electric power, advanced equipment manufacturing, transportation, laser, aerospace, ships, modern weapons, and frontier science of environmental protection. Power electronic devices usually operate under high voltage, high frequency, and high temperature, which poses a severe challenge to packaging reliability, especially electrical insulation reliability. Fitech provides reliable solder and solution support for various power device packaging.



功率器件焊料

The alloy component of eutectic gold-tin solder paste for power devices consists of 80wt% of gold and 20wt% of tin (Au80Sn20). Under the impacts of eutectic gold-tin solder paste properties and Fitech’s advanced powder manufacturing technology, Fitech’s eutectic gold-tin solder paste has several advantages such as high tensile strength, excellent corrosion resistance, outstanding thermal creep performance, and superior compatibility with other precious metals. It also has excellent performance of electrical conductivity and thermal conductivity.


Related Products

FH-280

Description
FH-280 series is eutectic gold-tin solder paste with a melting point of 280℃. It is suitable for high-reliability packaging of semiconductors and microelectronic devices and high thermal-conductive packaging of high-power devices. The melting point of gold-tin solder paste is high. Therefore, FH-280 can be used to avoid melting and failure of solder joints in secondary reflow. It has been used in military, aerospace, medical, and other fields. FH-280 gold-tin solder paste has excellent thixotropy, suitable viscosity, outstanding wettability, and brilliant soldering performance. In addition, it has a high melting point, high tensile strength, excellent oxidation and corrosion resistance, extraordinary thermal conductivity, and superior electrical conductivity. It complies with RoHS standards. It exhibits stable performance under high-temperature operation.




Features and Advantages

1. FH-280 is a type of solder paste with a high melting point and high tensile strength.

2. It has superior anti-oxidation and anti-corrosion performance, and it is compatible with other precious metals; 

3. It has outstanding thixotropy, suitable viscosity, excellent wettability, high tensile strength and extraordinary soldering performance; 

4. It has excellent thermal conductivity and electrical conductivity;

5. It is the priority choice in reflow soldering because of its high melting point;

6. It complies with RoHS standards.



Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product