福英达
福英达

POWER DEVICE PACKAGING

Power semiconductor devices, also known as power electronic devices, are mainly used for power conversion and control of power equipment. Power electronics is a supporting technology for modern science, industry, and national defense, and power devices are the core and foundation of power electronics technology. For instance, if the human body is used as an analogy, power electronic devices are equivalent to the cardiovascular and limbs of the human body that is responsible for supporting human activities. Power devices such as a thyristor, GTO, GTR, Power MOSFET, IGBT, IGCT, and others are widely applied in advanced energy, electric power, advanced equipment manufacturing, transportation, laser, aerospace, ships, modern weapons, and frontier science of environmental protection. Power electronic devices usually operate under high voltage, high frequency, and high temperature, which poses a severe challenge to packaging reliability, especially electrical insulation reliability. Fitech provides reliable solder and solution support for various power device packaging.



功率器件焊料

High-temperature lead-free solder paste for power devices is the solder paste with a minimum alloy melting point of 260°C., which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging. It is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. Different solder powder particle sizes and metal contents can be provided to satisfy various customers’ requirements for products and processes.


Related Products

FH-260

Description
FH260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260 series solder paste. It is a high-temperature lead-free product developed for secondary reflow soldering of power semiconductor and microelectronic packaging. The alloy is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. FH-260P series and FH-260D series are adapted to printing and dispensing processes, respectively.

Features and Advantages

1. FH260 is a lead-free antimony-free product exempt from RoHS;

2. It has excellent thixotropy, viscosity, wettability, and solderability;

3. It is achievable for high-density integrated circuit packaging and secondary reflow soldering of circuit boards;

4. The use of ultra-fine powder improves ultra-fine-pitch and micro-assembly printing performance;

5. It is a no-clean halogen-free product that only produces a tiny amount of residue.



Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product