福英达
福英达

INTEGRATED CIRCUIT PACKAGING

Integrated circuit packaging provides mechanical and electrical connections for IC chips. It also supplies physical protection. As a result, the integrated circuit chips have a stable and reliable operating condition. With the packaging development, manufacturers have adopted various advanced packaging technologies such as system-in-package (SiP) and system-on-chip (SoC), followed by a series of new challenges for packaging materials such as chip miniaturization, yield improvement, and cost reduction. Fitech provides reliable solder and solution support for integrated circuit packaging in various fields.



SiP Solution

A microcontroller unit (MCU) is one of the core components of modern electronic information intelligent control, also known as a single-chip microcomputer or single-chip microcomputer. It is a microcomputer that integrates main components such as a central processing unit (CPU), memory, timer/counter, various analog signal acquisition modules, and communication interfaces on a chip. The function of MCU is signal processing and control. It is widely used in household appliances, consumer electronics, medical equipment, computers, industrial control, automotive electronics, etc.

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