福英达
福英达

MINI/MICRO LED PACKAGING

Fitech 超微锡膏助力新型显示技术


The ultra-fine solder material produced by Fitech covers T6-T10 sizes, halogen-free, zero halogen-free, and halogen-free standards. The products can be used for printing, dispensing, jet printing, and other different processes. Fitch provides solder paste, epoxy solder paste, flux, and other products. The products provided for the customers engaged in Mini/Micro LED include LED packaging solder, fine-pitch solder, low-temperature fine-pitch solder, low-temperature high-reliability fine-pitch packaging solder, flip-chip packaging solder, camera module packaging solder, FPC packaging solder, and PCBA solder. Fitech has engaged in electronic and semiconductor packaging soldering materials for more than 20 years and sincerely customizes the most professional, suitable, and reliable solutions. 


Related applications

High-Strength Low-Temperature Solder for Mini LED Die Bond
COB Flip-chip Packaging Solder
FPC Low-Temperature Packaging Solder
BGA Flux for Mini/Micro LED

Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product