Packaging Solder for Chip Packaging of Medical Equipment

PRODUCTS

ULTRA-FINE SOLDER PASTE

ULTRA-FINE EPOXY SOLDER PASTE

GOLD-TIN SOLDER PASTE

SOLDER PASTE FOR MULTIPLE REFLOW SOLDERING

LASER SOLDER PASTE

JETTING SOLDER PASTE

FLUX

HIGH/LOW TEMPERATURE SOLDER PASTE

LEAD-FREE SOLDER PASTE

ULTRA-FINE SOLDER POWDER

LOW ALPHA SOLDER PASTE/SOLDER POWDER

SMT SOLDER POWDER

CUSTOMIZED PACKAGING SOLDER

Ultra-Fine Printing Solder Paste

Ultra-Fine Dispensing Solder Paste

Ultra-Fine Jetting Solder Paste

Ultra-Fine Pin-Transferred Solder Paste

Ultra-Fine No-Clean Solder Paste

Ultra-Fine Water-Soluble Solder Paste

Ultra-Fine Medium and High Temperature Solder Paste

Ultra-Fine Low-Temperature Solder Paste

T8 Ultra-Fine Solder Paste

T9 and T10 Ultra-Fine Solder Paste

FWS-305P

FTP-574

FTP-305

FTP-580

FTP-170

FH-260P

FTP-901

FSA-170D

FSA-305D

FTD-901

FTD-580

FTD-574

FTD-305

FH-280

FH-260D

FSA-574D

FTJ-901

FTJ-580

FTJ-305

FTJ-574

FTD-901

FTD-580

FTD-574

FTD-305

FH-280

FH-260D

FTJ-901

FTJ-580

FSA-170D

FTD/FTP-017

FTP-574

FTD/FTP-007

FSA-305D

FTD-170

FTD-901

FTJ-305

FTJ-574

FTD-580

FTD-574

FTD-305

FH-280

FH-260D

FSA-574D

FTP-305

FTP-580

FTP-170

FH-260P

FTP-901

FWS-305P

FWS-305L

FTJ-901

FTD-901

FTJ-305

FTD-305

FH-280

FH-260D

FTP-305

FH-260P

FTP-901

FTP-574

FTD-170

FTD-580

FTD-574

FTP-580

FTP-170

FACA-138D

FWS-305P

FTJ-580

FTD-170

FTJ-574

FTD-580

FTD-305

FTP-305

FTP-580

FTP-170

FTP-574

FTD-574

FTD-305

FTP-305

Low-Temperature Ultra-Fine Epoxy Solder Paste

Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Specialized Epoxy Solder Paste for Micro LED

Anisotropic Conductive Paste

FSA-170D

FSA-170P

FSA-574P

FSA-574D

FACA-138D

FSA-305P

FSA-901P/D

FSA-305D

FACA-138D

FACA-138D

Gold-Tin Solder Paste

FH-280

High-Temperature Solder Paste for Multiple Reflow Soldering

Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

FH-260D

FH-260P

FSA-170D

FSA-170P

FTD-170

FTP-170

Water-Soluble Solder Paste for Laser Soldering

FWS-305L

Jetting Solder Paste

FTJ-901

FTJ-580

FTJ-305

FTJ-574

Fine-Pitch Reflow-Soldering / Evaporation-Soldering Flux

FEF-240

High-Temperature Lead-Free Solder Paste

SAC305 Series Solder Paste

Low-Temperature SnBiAg Solder Paste

Low-Temperature High-Reliability Solder Paste

FTJ-901

FSA-901P/D

FTD-901

FH-260D

FH-260P

FTP-901

FWS-305P

FSA-305P

FWS-305L

FSA-305D

FTJ-305

FTD-305

FTP-305

FTP-574

FSA-574P

FTJ-574

FTD-574

FSA-574D

FSA-170D

FSA-170P

FTD-170

FTP-170

SAC305

SnBiAg Solder Paste/Epoxy Solder Paste

Low-Temperature High-Reliability Solder Paste/Epoxy Solder Paste

Lead-Free Silver-Free Solder Paste/Sn-Cu Solder Paste

High-Temperature Lead-Free Solder Paste

Gold-Tin Solder Paste

FWS-305P

FSA-305P

FWS-305L

FSA-305D

FTJ-305

FTD-305

FTP-305

FTP-574

FSA-574P

FTJ-574

FTD-574

FSA-574D

FSA-170D

FSA-170P

FTD-170

FTP-170

FTD/FTP-017

FTD/FTP-007

FTJ-901

FSA-901P/D

FTD-901

FH-260D

FH-260P

FTP-901

FH-280

Lead-Free LA < 0.01cph/cm2

Lead-Free ULA＜0.002cph/cm2

High-Lead LA <0.01cph/cm2

FWS-305P

APPLICATIONS

MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

INTEGRATED CIRCUIT PACKAGING

MEMS PACKAGING

POWER DEVICE PACKAGING

SAC305 Ultra-Fine Die Bond Solder Paste

Low-Temperature Ultra-Fine Die Bond Solder

High-Strength Ultra-Fine Die Bond Solder Paste

Fitech Anisotropic Conductive Adhesive (FACA)

Ultra-Fine-Pitch Flux

Flip-chip Die Bond Solder Paste

FPC Low-Temperature Epoxy Solder Adhesive

FWS-305L

FWS-305

FT-305

FT-574

FSA-574

FSA-170/180/200

FL-170/180/200

FSA-305

FACA-138

FEF-180/240

Fitech™ mLED 1550

Fitech™ mLED 1370

FSA-170/180/200

FSA-574

Low-Alpha High-Lead Solder

Lead-Free Silver-Free Solder for SiP

Water-Soluble Solder Paste for SiP

Low-Alpha Lead-Free Solder

Ultra-Fine-Pitch Flux

SAC305 Series Solder Paste

Low-Temperature Solder Paste for Component Mounting

Low-Temperature Epoxy Solder Paste for Component Mounting

MCU Packaging Solder

FLA-925/FLA-950

FT-007/FT-017

FWS-305

FLA-305

FEF-180/240

FT-305

FL-170/180/200

FT-574

FSA-170/180/200

FSA-305

Gold-Tin Solder Paste for MEMS Packaging

Solder for MEMS Reflow Soldering

High-Reliability Low-Temperature Solder Paste

High-Reliability Low-Temperature Epoxy Solder Paste

Water-Soluble Laser Solder Paste

Low-Temperature Epoxy Solder Paste for Camera Modules

FH-280

FT-901

FL-170/180/200

FH-260

FT-305

FL-170/180/200

FSA-170/180/200

FWS-305L

FSA-170/180/200

FSA-574

Au80Sn20 Gold-Tin Solder for Power Devices

High-Temperature Lead-Free Solder Paste for Power Devices

Water-Soluble Solder Paste for Power Devices

Conventional Solder for Power Devices

FH-280

FH-260

FWS-305

FT-901

FT-305

FWS-305L

MARKET AREA

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

RAIL TRANSIT

5G

IOT & WEARABLES

3C PRODUCTS

MILITARY & AEROSPACE

MEDICAL EQUIPMENT

Low-Temperature Solder for Mini LED Die Bond

Medium-Temperature Solder for Mini LED Die Bond

High-Strength Low-Temperature Solder for Mini LED Die Bond

COB Flip-chip Packaging Solder

FPC Low-Temperature Packaging Solder

BGA Flux for Mini/Micro LED

PCBA Solder

Automotive Power Module Packaging Solder

In-Vehicle Infotainment Packaging Solder

Automotive LED Packaging Solder

Automotive MEMS Packaging Solder

MCU Packaging Solder for Automotive Electronics

Rail Transit IGBT Packaging

SiP Solder for Baseband Chips

High-Reliability Packaging of Memory Chips

RF Power Device Packaging

PCBA Packaging

Multiple Reflow Packaging

IoT Security Chips and Payment Chips SiP

IoT Identity Verification and MEMS SiP

RF Power Devices and Chips Packaging

PCBA Packaging

MCU Packaging

Camera Modules Packaging

No-Clean Solder Paste/ Solder Adhesive for 3C Products

High-Reliability Water-Soluble Solder Paste for 3C Products

High-Strength Low-Temperature Solder Paste/Epoxy Solder Adhesive

MCU Packaging Solder for 3C Products

High-Reliability High-Temperature Solder (Au80Sn20)

Low alpha High-Lead Solder for High-Reliability Packaging

Au80Sn20 Solder Paste

Medical Equipment SiP

Laser Solder for Complex Structures

Precision Structures Low-Temperature Packaging

MCU Packaging

Low-Temperature Solder for Mini LED Die Bond

TECHNICAL SUPPORT

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Service area

Home > Service Area > MEDICAL EQUIPMENT

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

RAIL TRANSIT

5G

IOT & WEARABLES

3C PRODUCTS

MILITARY & AEROSPACE

MEDICAL EQUIPMENT

智慧医疗设备芯片封装锡膏焊料

Fitech offers safe and high-reliability materials and solutions for chip packaging of medical equipment.

Related applications

Au80Sn20 Solder Paste

>>Au80Sn20 Solder Paste

Medical Equipment SiP

>>Water-Soluble Solder Paste for SiP

>>Low Alpha Lead-Free Solder

>>SAC305 Series Solder Paste

Laser Solder for Complex Structures

>>Water-Soluble Laser Solder Paste

Precision Structures Low-Temperature Packaging

>>Low-Temperature Solder Paste for Component Mounting

>>Low-Temperature Epoxy Solder Adhesive for Component Mounting

MCU Packaging

>>MCU Packaging Solder

MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

Learn more

INTEGRATED CIRCUIT PACKAGING

Learn more

MEMS PACKAGING

Learn more

POWER DEVICE PACKAGING

Learn more

Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product

Shenzhen Fitech Co.,Ltd.

Tel ： +86 177 2251 7101

Fax : 0755-26820233

Email : jiangtao@szfitech.com

Products Applications Market Area Technical Support News About Us

+86 177 2251 7101

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