福英达
福英达

ULTRA-FINE SOLDER PASTE

Ultra-fine solder paste

T6, T7, T8, T9, and T10 solder powder are called ultra-fine solder powder because of their small particle sizes. Solder paste consisting of T6 to T10 solder powders is called ultra-fine solder paste. With the continuous development of the microelectronics and semiconductor industry, the chip size is getting smaller while the packaging density is getting higher. It's hard to meet the requirements of microelectronics and semiconductor packaging with traditional solder paste products of T4 and above. Currently, the solder paste used in packaging is increasingly being "ultra micronized".



Fitech is the world's leading supplier of ultra-fine solder powder and solder paste. Fitech has world-leading production lines of tin-based ultra-fine solder powder. Fitech's Tin-based ultra-fine solder powder products have the advantages of high purity, narrow particle size distribution, excellent sphericity, and outstanding quality stability. Fitech is currently the only packaging material supplier in the world that can produce T2-T10  electronic-grade solders.


ULTRA-FINE SOLDER PASTE

Jetting solder paste is a high-end product specifically suitable for jet printing. Jet printing is a non-stencil solder spray coating technology, which provides a new process method besides printing and dispensing. Specialized ejector structures spray solder paste at extremely high speeds over the substrate. Jet printing allows the ejector to remain contactless with the pad similar to inkjet printing. Jet printing technology can meet increasingly complex substrates and the highest quality requirements. Users can control the usage of solder paste required for each component's lead to optimize solder joint quality. Jet printing allows solder paste to distribute on the complex substrate with uneven structure and is suitable for the TFT process. 


T7 Jetting Solder Paste


FTJ-901
FTJ-580
FTJ-305
FTJ-574

Description

SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTJ-901 series solder paste based on metallurgical method and chemical structure. The solder paste has a superior adhesion effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-slump, and residue reduction properties. It is developed to meet the marketing demand for heat-resistant microelectronic device assembly and precision soldering. The product has an extraordinary heat resistance and heat dissipation. It also improves voiding behavior and the strength and conductivity of intermetallic compounds.


Properties

1. Before Curing

FTJ-901 Properties Before Curing


2. After Curing: 

FTJ-901 Properties After Curing



Product Display


Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.



Description

Lead-free silver-free Sn42Bi58 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FTJ-580 series low-temperature jetting solder paste. The solder powder has an excellent surface finish, and the crystallinity of the flux is small. The solder sprays smoothly, reducing the adverse impact of blockage. In addition, only a small amount of solvent volatilizes during the soldering process. The solder paste has outstanding residue minimization and wettability. There is no solder ball formation during soldering, and the solder joints generated are plump and bright. FTJ-580 is ideal for low-temperature soldering, especially for low-temperature component mounting. 


Properties
1. Before Curing

FTJ-580 Properties Before Curing


2. After Curing

FTJ-580 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°CWhen taking out solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases the vaporizatipn rate of water, which is easy to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin" to produce tin beads and even damage the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象产生锡珠,甚至损坏元器件。

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin", resulting in tin beads and even damage to the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象,产生锡珠,甚至损坏元器件。

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2. Warming Method: The solder paste remaining sealed should rewarm to room temperature naturally; Rewarm no more than twice.

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than twice;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过两次;

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than two times;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过2次;

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3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

The actual time required to reach thermal equilibrium varies by vessel size.

达到热平衡所需的实际时间因容器尺寸而异。

The actual time required to reach thermal equilibrium will vary depending on the size of the vessel.

达到热平衡所需的实际时间将根据容器的大小而有所不同。

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4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

4. Note: Do not open the bottle cap without sufficient "rewarming", and do not shorten the "rewarming" time by heating;

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4. Note: Do not open the bottle cap without sufficient "rewarming", and the "rewarming" time cannot be shortened by heating;

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5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.


Description

Fitech produces SAC305 ultra-fine lead-free solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is combined with halogen-free flux to prepare FTJ-305 series solder paste. The solder powder has a superior surface finish, and the crystallinity of the flux is small. The solder sprays smoothly, keeping the needle away from blockage. In addition, only a small amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. Moreover, FTJ-305 does not contact the pad and has outstanding wettability, anti-slump, and residue reduction properties. It is an ideal solder for micro-bump ultra-fine-pitch packaging.


Properties
1. Before Curing

FTJ-305 Properties Before Curing


2. After Curing

FTJ-305 Properties After Curing


Product Display

Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.


Description

Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTJ-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTJ-574 has outstanding wettability. The solder joints generated are plump and bright. The product is suitable for low-temperature component mounting.


Properties
1. Before Curing

FTJ-574 Properties Before Curing


2. After Curing

FTJ-574 Properties After Curing


Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases vaporization of water, which may to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming shorten the rewarming time by using heat sources.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operation Time
After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. The recommended dwell time of normal solder paste is no more than 4 hours, while the dwell time of low temperature bismuth-containing solder paste should not exceed 2 hours.

Our engineers will be happy to answer your questions or help you choose the right solder product