福英达
福英达

ULTRA-FINE SOLDER PASTE

Ultra-fine solder paste

T6, T7, T8, T9, and T10 solder powder are called ultra-fine solder powder because of their small particle sizes. Solder paste consisting of T6 to T10 solder powders is called ultra-fine solder paste. With the continuous development of the microelectronics and semiconductor industry, the chip size is getting smaller while the packaging density is getting higher. It's hard to meet the requirements of microelectronics and semiconductor packaging with traditional solder paste products of T4 and above. Currently, the solder paste used in packaging is increasingly being "ultra micronized".



Fitech is the world's leading supplier of ultra-fine solder powder and solder paste. Fitech has world-leading production lines of tin-based ultra-fine solder powder. Fitech's Tin-based ultra-fine solder powder products have the advantages of high purity, narrow particle size distribution, excellent sphericity, and outstanding quality stability. Fitech is currently the only packaging material supplier in the world that can produce T2-T10  electronic-grade solders.


ULTRA-FINE SOLDER PASTE

T8 Ultra-Fine Solder Paste

With the continuous miniaturization of electronic components, the evolving semiconductor packaging is placing newer requirements on packaging solders. For semiconductor packaging solder paste, an important requirement is the ultra-micronization of solder powder. Especially in the new display industry, the pixel pitch of Mini LED/Micro LED display technology has been reduced to less than 1mm or even less than 0.5mm. The size of display chips has been reduced to 100um or even less than 50um, which puts forward high requirements of packaging solder paste. Currently, several major suppliers are still selling T7(2-11μm), T6 (5-15μm) solder pastes and other solder pastes with particle sizes greater than 15μm. T8 solder paste products are still under development.

Nearly 20 years ago, Fitech took the lead in the development and production of ultra-fine solders in the world and took the lead in launching T8 and T9 ultra-fine powder and solder paste products.


 Fitech's T8 solder paste is reliable because of high sphericity and norrow particle size distribution.


 

Product Comparisons Between Fitech and Others


Sphericity Comparison of T8 Solder Powder

Pictures on top : Fitech;   Pictures at the bottom: Another company 
Fitech’s T8 ultra-fine solder powder (2-8μm>94%) is plump and has perfect spherical shape.


Benefits of High Sphericity

◆ Smooth soldering       ◆ Uniform solder joints
High reliablity             ◆ Reduced likelihood of needle blockage

◆ More durable equipment


● Better anti-oxidation performance enhance viscosity stability of Fitech's T8 solder paste.


Viscosity Changes





     Viscosity stability of Continuous Printing Solder Paste

     Blue line:Fitech's product;  Organe line:Normal product
     Fitech's ultra-fine solder powder has better anti-oxidation effect and
      viscosity stability.

  

     Fitech's T8 ultra-fine solder paste products include:

FWS-305P
FTJ-580
FTD-170
FTJ-574
FTD-580
FTD-305
FTP-305
FTP-580
FTP-170

Description

The main alloy of FWS-305P water-soluble solder paste is tin-silver-copper (SAC305). The water-soluble solder paste product is prepared by mixing T5, T6, T7, or T8 alloy powder with halogen-free environmental-protection flux.

Features

1. The alloy has excellent sphericity, uniform particle size, and low oxygen content;
2. Outstanding halogen-free flux is used;
3. It has superior adhesion performance before soldering;
4. The solder paste has excellent viscosity stability and superior stencil life;
6. It is an ideal solder with extraordinary water cleaning performance for high-reliability micro-bump ultra-fine-pitch packaging.

Properties
Before Curing:

FWS-305P Properties Before Curing


After Curing:

FWS-305P Properties After Curing



Product Display

FWS-305P Display


Instructions
Warming Method:
The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-55%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25 and 40.


Description

Lead-free silver-free Sn42Bi58 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FTJ-580 series low-temperature jetting solder paste. The solder powder has an excellent surface finish, and the crystallinity of the flux is small. The solder sprays smoothly, reducing the adverse impact of blockage. In addition, only a small amount of solvent volatilizes during the soldering process. The solder paste has outstanding residue minimization and wettability. There is no solder ball formation during soldering, and the solder joints generated are plump and bright. FTJ-580 is ideal for low-temperature soldering, especially for low-temperature component mounting. 


Properties
1. Before Curing

FTJ-580 Properties Before Curing


2. After Curing

FTJ-580 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°CWhen taking out solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases the vaporizatipn rate of water, which is easy to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin" to produce tin beads and even damage the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象产生锡珠,甚至损坏元器件。

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin", resulting in tin beads and even damage to the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象,产生锡珠,甚至损坏元器件。

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2. Warming Method: The solder paste remaining sealed should rewarm to room temperature naturally; Rewarm no more than twice.

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than twice;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过两次;

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than two times;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过2次;

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3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

The actual time required to reach thermal equilibrium varies by vessel size.

达到热平衡所需的实际时间因容器尺寸而异。

The actual time required to reach thermal equilibrium will vary depending on the size of the vessel.

达到热平衡所需的实际时间将根据容器的大小而有所不同。

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4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

4. Note: Do not open the bottle cap without sufficient "rewarming", and do not shorten the "rewarming" time by heating;

...

4. Note: Do not open the bottle cap without sufficient "rewarming", and the "rewarming" time cannot be shortened by heating;

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5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.


Description

Low-temperature FL170 alloy solder powder with good sphericity, uniform particle size, low oxygen content, and high strength are combined with zero-halogen flux to produce FTD-170 series low-temperature solder paste. Only a small amount of solvent volatilizes during the soldering process. There is no solder ball formation after soldering. The solder paste has excellent performance of residue minimization and wettability. The solder joints generated are strong, plump, and bright. FTD-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 

Properties
1. Before Curing

FTD-170 Properties Before Curing


 2. After Curing

FTD-170 Properties After Curing



Product Display

FTD-170 Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste.The high temperature exceeding 150°C during soldering increases the vaporization of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heat sources.

5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low-temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to the narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.


Description

Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTJ-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTJ-574 has outstanding wettability. The solder joints generated are plump and bright. The product is suitable for low-temperature component mounting.


Properties
1. Before Curing

FTJ-574 Properties Before Curing


2. After Curing

FTJ-574 Properties After Curing


Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases vaporization of water, which may to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming shorten the rewarming time by using heat sources.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operation Time
After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. The recommended dwell time of normal solder paste is no more than 4 hours, while the dwell time of low temperature bismuth-containing solder paste should not exceed 2 hours.

Description

Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with outstanding halogen-free flux to prepare FTD-580 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTD-580 has extraordinary wettability. The solder joints generated are plump and bright. The product is suitable for low-temperature component mounting. 

Properties

1. Before Curing

FTD-580 Properties Before Curing


2. After Curing

FTD-580 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste  from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste.The high temperature exceeding 150°C during soldering rapidly increases vaporizatipn of water, which is easy to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heat sources.

5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.



Description

Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTD-305 series solder paste. The solder paste has superior adhesion before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTD-305  has outstanding wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. The product is an ideal solder for micro-bump ultra-fine-pitch packaging.


Properties

1. Before Curing:

FTD-305 Properties Before Curing


2. After Curing:

FTD-305 Properties After Curing



Product Display

Product DIsplay of FTD-305 (Lead-Free Solder Paste for Dispensing)


Product DIsplay of FTD-305 (Lead-Free Solder Paste for Dispensing)



Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.



Description

Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTP-305 has outstanding wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. The product is ideal for micro-bump ultra-fine-pitch packaging.


Properties
1. Before Curing

FTP-305 Properties Before Curing



2. After Curing

FTP-305 Properties After Curing



Product Display

FTP-305 Solder Paste


Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.






Description

Fitech’s tin-bismuth alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTP-580 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation and only a small amount of residue forms after soldering. Moreover, the product has outstanding wettability. The solder joints are plump and bright. FTP-580 is effective for low-temperature component mounting.


Properties

1. Before Curing

FTP-580 Properties Before Curing


2. After Curing

FTP-580 Properties After Curing



Product Display

Instructions
1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When the solder paste is taken out from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste.The high temperature exceeding 150°C during soldering increases the vaporization of water, which is easy to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heat sources.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effect. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.


Description

Low-temperature FL170 alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength are combined with zero-halogen flux to produce FTP-170 series low-temperature solder paste. Only a small amount of solvent volatilizes during the soldering process. There is no solder ball formation after soldering. In addition, FTP-170 has an excellent performance in residue minimization and wettability. The solder joints generated are strong, plump, and bright. The product is ideal for low-temperature soldering, especially for low-temperature component mounting.

Properties
1. Before Curing

FTP-170 Properties Before Curing


2. After Curing
   

FTP-170 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste.The high temperature exceeding 150°C during soldering increases the vaporization of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.


Our engineers will be happy to answer your questions or help you choose the right solder product