福英达
福英达

HIGH/LOW TEMPERATURE SOLDER PASTE

Product's Details

The compositions of alloy and flux in solder pastes are different, leading to different soldering temperatures. Therefore, Fitech divides solder paste products into different categories according to soldering temperatures, including high-temperature, medium-high temperature, medium-temperature, and low-temperature solder pastes. Solder paste with high soldering temperature tends to have better soldering strength. It is suitable for the soldering processes that require high soldering strength. It is also applicable for the first reflow of secondary-reflow soldering. Differ from high-temperature solder paste, low-temperature solder paste tends to protect circuit boards and is suitable for temperature-sensitive circuit boards and devices. Low-temperature solder paste is used in the second reflow of secondary-reflow soldering.


FTP-574
FSA-574P
FTJ-574
FTD-574
FSA-574D

Description

Fitech's tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTP-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation and only a small amount of residue forms after soldering. Moreover, the product has outstanding wettability, and the solder joints generated are plump and bright. It is effective for low-temperature component mounting. 

Properties

1. Before Curing

FTP-574 Properties Before Curing

 

2. After Curing:

FTP-574 Properties After Curing


Product Display


Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When the solder paste is taken out from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases vaporizatipn of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming by using heat equipment.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.





Description

FSA-574P series low-temperature lead-free epoxy solder paste products are made of low-temperature ultra-fine SnBi solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and solidification process. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. FSA-574P epoxy solder paste is unnecessary to clean. The solder residue becomes thermoset adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. FSA-574P is suitable for the reliable packaging of thin substrates and non-heat-resistance components.


Properties

1. Before Curing

FSA-574P Properties Before Curing


2. After Curing

FSA-574P Properties After Curing



Product Display


Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operation Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.



Description

Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTJ-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTJ-574 has outstanding wettability. The solder joints generated are plump and bright. The product is suitable for low-temperature component mounting.


Properties
1. Before Curing

FTJ-574 Properties Before Curing


2. After Curing

FTJ-574 Properties After Curing


Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases vaporization of water, which may to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming shorten the rewarming time by using heat sources.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operation Time
After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. The recommended dwell time of normal solder paste is no more than 4 hours, while the dwell time of low temperature bismuth-containing solder paste should not exceed 2 hours.

Description

Fitech’s tin-bismuth-silver solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTD-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTD-574 has outstanding wettability. The solder joints generated are plump and bright. The product is effective for low-temperature component mounting. 

Properties
1.
Before Curing

FTD-574 Properties Before Curing



2. After Curing

FTD-574 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste usually needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases the vaporization of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

The temperature exceeds 150℃), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin" to produce tin beads and even damage the components.

温度超过150℃),水受强热迅速汽化,易造成爆锡现象产生锡珠,甚至损坏元器件。

The temperature exceeds 150℃), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin", resulting in tin beads and even damage to the components.

温度超过150℃),水受强热迅速汽化,易造成爆锡现象,产生锡珠,甚至损坏元器件。

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2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than twice;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过两次;

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than two times;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过2次;

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3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

The actual time required to reach thermal equilibrium varies by vessel size.

达到热平衡所需的实际时间因容器尺寸而异。

The actual time required to reach thermal equilibrium will vary depending on the size of the vessel.

达到热平衡所需的实际时间将根据容器的大小而有所不同。

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4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Note: Do not open the bottle cap without sufficient "rewarming", and do not shorten the "rewarming" time by heating;

注意:没有充分复温就不要打开瓶盖,也不要通过加热来缩短复温时间;

Note: Do not open the bottle cap without sufficient "rewarming", and the "rewarming" time cannot be shortened by heating;

注意:没有充分复温就不要打开瓶盖,加热不能缩短复温时间;

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The actual time required to reach thermal equilibrium varies by vessel size.

达到热平衡所需的实际时间因容器尺寸而异。

The actual time required to reach thermal equilibrium will vary depending on the size of the vessel.

达到热平衡所需的实际时间将根据容器的大小而有所不同。

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4. Note: Do not open the bottle cap without sufficient "rewarming", and do not shorten the "rewarming" time by heating;

...

4. Note: Do not open the bottle cap without sufficient "rewarming", and the "rewarming" time cannot be shortened by heating;

...

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5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operation Time

① Continuous printing time: When adding solder paste continuously: 8 hours. In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil; ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.

Description

FSA-574D series low-temperature lead-free epoxy solder paste is composed of low-temperature ultra-fine SnBi solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and solidification process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-574D epoxy solder paste is unnecessary to clean. Solder residue becomes thermosetting adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. FSA-574D is suitable for the reliable packaging of thin substrates and non-heat-resistant components


Properties

1. Before Curing

FSA-574D Properties Before Curing


2. After Curing:

FSA-574D Properties After Curing


Product Display

FSA-574D Display

Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.


Our engineers will be happy to answer your questions or help you choose the right solder product