Fine-pitch flux assists in the manufacturing, assembly, and packaging of microelectronics and semiconductors. It is suitable for high precision and reliability packaging of wafer bumping soldering, chip evaporation soldering, BGA, SiP, CSP, Micro LED packaging, module integrated circuits, etc. Fitech's zero-halogen epoxy flux has self-assembly and self-correction functions. Epoxy curing after soldering provides excellent insulation, corrosion resistance, and reliability performance, and it is compatible with underfill and bonding. It can be used in the printing or dispensing process.
FEF-240 is a zero-halogen epoxy solder flux, which does not contain rosin and is free to clean after soldering. There is no spattering during soldering. The soldering residue becomes thermoset adhesive to strengthen the solder joints and improve the performance of anti-corrosion and insulation. The epoxy flux has many advantages like no cleaning necessary, self-assembly, and self-correction, which is ideal for soldering, and especially suitable for high-precision and high-reliability microelectronic packaging.
1. Before Curing：
2. Corrosion and Electrical Reliability Tests：
3. After Curing：
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.