福英达
福英达

LEAD-FREE SOLDER PASTE

Product's Details


Fitech produced lead-free solder paste under the idea of "lead-free electronics" which refers to the solder paste that the total concentration of toxic and harmful substances including mercury (Hg), cadmium (Cd), hexavalent chromium (Cr), lead (Pb), polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)) should not exceed 1000ppm. Lead-free solder paste should have outstanding wettability, solderability, electrical conductivity, and thermal conductivity. Moreover, it should have extraordinary reliability, compatibility, and economic benefit.


无铅焊锡膏


Lead-free solder pastes developed for different scenarios include the SAC305 series, tin-bismuth-silver series, lead-free silver-free series, high-temperature lead-free series, low-temperature high-reliability series, and gold-tin solder paste. All products have been widely used in microelectronics and semiconductor packaging.



The lead-free and silver-free solder series developed by Fitech aims to solve the electromigration of conventional SAC solder due to the existence of silver. According to the different requirements of customers, Fitech provides T6-T9 solder products with alloy components such as SnCuX, SN100C, etc. In addition, the products include ultra-fine solder powder, no-clean solder paste, water-soluble solder paste, epoxy solder paste, etc. The lead-free silver-free solder series has excellent powder sphericity, narrow particle size distribution, lead-free silver-free alloys, no silver migration, bright solder joints, and outstanding wettability.

FTD/FTP-017
FTD/FTP-007

Product Display

Properties

FTD-017/FTP-017 Properties


Precautions
1. Peak reflow temperature: 25-45°C above melting temperature;
2. Type 5 solder reflows under nitrogen protection (oxygen content200PPM);
3. Type 6 solder reflows under nitrogen protection (oxygen content<100PPM);
4. Store at 0-10°C.


SnCuX Precautions

Product Display

Properties

FTD-007/FTP-007 Properties


Precautions
1. Peak reflow temperature: 25-45°C above the melting temperature;
2. Type 5 solder reflows under nitrogen protection (oxygen content<200PPM);
3. Type 6 solder reflows under nitrogen protection (oxygen content<100PPM);
4. Store at 0-10°C.

SnCuX Precautions

Our engineers will be happy to answer your questions or help you choose the right solder product