福英达
福英达

GOLD-TIN SOLDER PASTE

Product's Details

Gold-tin solder paste is one of the most reliable solder materials for microelectronics and semi-conductor, which can be used in military, aerospace, and medical equipment with reliable packaging. Moreover, gold-tin solder paste is available for SiP and high thermal conductivity packaging of high-power devices. Gold-tin solder paste has excellent soldering properties and outstanding soldering reliability because of its metallic properties. 

Fitech's Gold-Tin Solder Paste


The alloy of Fitech's FH-280 series eutectic gold-tin solder paste consists of 80wt% of gold and 20wt% of tin (Au80Sn20). Under the impact of excellent characteristics of the FH-280 product and Fitech's advanced powder manufacturing technology, FH-280 has several advantages such as high tensile strength, outstanding corrosion resistance, excellent thermal creep performance, and extraordinary compatibility with other precious metals. It also has excellent electrical conductivity and thermal conductivity. FH280 series solder paste has a melting point of 280℃ and particle sizes covering T3 to T6. It supports the printing and dispensing process.




FH-280

Description

An80Sn20 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-280 series solder paste. FH-280 has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. In addition, the solder paste has outstanding wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. Moreover, FH-280 has high tensile strength, excellent corrosion resistance, high melting point, and extraordinary thermal creep performance. FH-280 is compatible with other precious metals and has excellent electrical and thermal conductivity. The product is suitable for the high-reliability packaging of semiconductors and microelectronic devices. It is applied to the high thermal conductivity packaging of high-power devices.


Properties
1. Before Curing

FH-280 Properties Before Curing


2. After Curing

FH-280 Properties After Curing



Product Display

FH-280 Display



Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.




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