福英达
福英达

JETTING SOLDER PASTE

Product's Details

Jet printing technology is defined as the precise distribution of solder paste on the pads in a non-contact manner by a solder paste jet printer. The solder paste used is called jetting solder paste. Jetting solder paste is suitable for the small-batch production that is inconvenient using printing or dispensing processes, such as camera modules, FPC flexible circuit boards, thermal devices, and MEMS micro-electromechanical systems. Jetting solder paste must have outstanding viscosity properties related to thixotropy and rheology, and other properties such as wettability. The jetting solder paste produced by Fitech covers different alloy components and soldering temperatures. The jetting solder paste has excellent powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity.




T7 Jetting Solder Paste

FTJ-901
FTJ-580
FTJ-305
FTJ-574

Description

SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTJ-901 series solder paste based on metallurgical method and chemical structure. The solder paste has a superior adhesion effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-slump, and residue reduction properties. It is developed to meet the marketing demand for heat-resistant microelectronic device assembly and precision soldering. The product has an extraordinary heat resistance and heat dissipation. It also improves voiding behavior and the strength and conductivity of intermetallic compounds.


Properties

1. Before Curing

FTJ-901 Properties Before Curing


2. After Curing: 

FTJ-901 Properties After Curing



Product Display


Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.



Description

Lead-free silver-free Sn42Bi58 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FTJ-580 series low-temperature jetting solder paste. The solder powder has an excellent surface finish, and the crystallinity of the flux is small. The solder sprays smoothly, reducing the adverse impact of blockage. In addition, only a small amount of solvent volatilizes during the soldering process. The solder paste has outstanding residue minimization and wettability. There is no solder ball formation during soldering, and the solder joints generated are plump and bright. FTJ-580 is ideal for low-temperature soldering, especially for low-temperature component mounting. 


Properties
1. Before Curing

FTJ-580 Properties Before Curing


2. After Curing

FTJ-580 Properties After Curing



Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°CWhen taking out solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases the vaporizatipn rate of water, which is easy to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin" to produce tin beads and even damage the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象产生锡珠,甚至损坏元器件。

The temperature exceeds 150), the water vaporizes rapidly due to the strong heat, which is easy to cause the phenomenon of "exploding tin", resulting in tin beads and even damage to the components.

温度超过150℃),水受强热迅速汽化,易造成“爆锡”现象,产生锡珠,甚至损坏元器件。

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2. Warming Method: The solder paste remaining sealed should rewarm to room temperature naturally; Rewarm no more than twice.

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than twice;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过两次;

2. Warming method: Under the premise of not opening the lid, return to temperature naturally at room temperature; the number of times of returning to temperature is no more than two times;

2、升温方法:在不开盖的前提下,在室温下自然回温;回温次数不超过2次;

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3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

The actual time required to reach thermal equilibrium varies by vessel size.

达到热平衡所需的实际时间因容器尺寸而异。

The actual time required to reach thermal equilibrium will vary depending on the size of the vessel.

达到热平衡所需的实际时间将根据容器的大小而有所不同。

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4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

4. Note: Do not open the bottle cap without sufficient "rewarming", and do not shorten the "rewarming" time by heating;

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4. Note: Do not open the bottle cap without sufficient "rewarming", and the "rewarming" time cannot be shortened by heating;

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5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.


Description

Fitech produces SAC305 ultra-fine lead-free solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is combined with halogen-free flux to prepare FTJ-305 series solder paste. The solder powder has a superior surface finish, and the crystallinity of the flux is small. The solder sprays smoothly, keeping the needle away from blockage. In addition, only a small amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. Moreover, FTJ-305 does not contact the pad and has outstanding wettability, anti-slump, and residue reduction properties. It is an ideal solder for micro-bump ultra-fine-pitch packaging.


Properties
1. Before Curing

FTJ-305 Properties Before Curing


2. After Curing

FTJ-305 Properties After Curing


Product Display

Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.


Description

Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent zero-halogen flux to prepare FTJ-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTJ-574 has outstanding wettability. The solder joints generated are plump and bright. The product is suitable for low-temperature component mounting.


Properties
1. Before Curing

FTJ-574 Properties Before Curing


2. After Curing

FTJ-574 Properties After Curing


Product Display

Instructions

1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10°C. When taking out the solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap is opened without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150°C during soldering increases vaporization of water, which may to cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

4. Note: Do not open the bottle cap without sufficient rewarming shorten the rewarming time by using heat sources.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operation Time
After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. The recommended dwell time of normal solder paste is no more than 4 hours, while the dwell time of low temperature bismuth-containing solder paste should not exceed 2 hours.

Our engineers will be happy to answer your questions or help you choose the right solder product